2024年4月11日发(作者：)

磁控溅射镀膜对基片的作用

English Answer:

Magnetron sputtering deposition is a physical vapor

deposition (PVD) method that uses a magnetron to generate a

plasma discharge and sputter atoms from a target material

onto a substrate. The process involves bombarding the

target material with energetic ions, causing atoms to be

ejected and deposited on the substrate.

The effects of magnetron sputtering deposition on the

substrate depend on various factors, including the target

material, deposition parameters, and substrate properties.

Here are some general effects:

Surface Modification: Magnetron sputtering deposition

can modify the surface properties of the substrate, such as

its chemistry, morphology, and roughness. By depositing

different materials, it is possible to create tailored

surfaces with desired properties, such as improved adhesion,

corrosion resistance, or electrical conductivity.

Thin Film Growth: Magnetron sputtering is widely used

for thin film deposition, where a thin layer of a material

is deposited on the substrate. The deposited film can have

a thickness ranging from a few nanometers to several

micrometers. The film's properties depend on the target

material, deposition parameters, and post-deposition

treatments.

Interface Formation: Magnetron sputtering deposition

can create interfaces between different materials, such as

metal-semiconductor or dielectric-metal interfaces. The

properties of the interface, such as its bonding

characteristics and structural stability, are crucial for

the performance and reliability of devices.

Stress and Strain: The deposition process can

introduce stress and strain into the substrate due to the

momentum transfer from the sputtered particles. This can

affect the mechanical and electrical properties of the

substrate, particularly in the case of thin films with high

internal stresses.

Substrate Heating: The plasma discharge and the

bombardment of sputtered particles can generate heat on the

substrate. This heating can affect the substrate's

temperature and potentially lead to thermal expansion,

diffusion, or phase transformations.

中文回答：

磁控溅射镀膜对基片的作用：

磁控溅射镀膜是利用磁控管产生等离子体放电，使靶材原子溅

射到基片上的物理气相沉积（PVD）方法。该工艺包括用高能离子轰

击靶材，导致原子被溅射出来并沉积在基片上。

磁控溅射镀膜对基片的影响取决于靶材、沉积参数和基片性质

等多种因素。以下列出一些一般性影响：

表面改性，磁控溅射镀膜可以改变基片的表面性质，例如其化

学性质、形貌和粗糙度。通过沉积不同的材料，可以制造出具有所

需性质的定制表面，例如改善附着力、耐腐蚀性或导电性。

薄膜生长，磁控溅射广泛用于薄膜沉积，其中基片上沉积一层

薄薄的材料。沉积膜的厚度从几纳米到几微米不等。薄膜的性质取

决于靶材、沉积参数和沉积后处理。

界面形成，磁控溅射镀膜可以在不同材料之间形成界面，例如

金属-半导体或介电质-金属界面。界面的性质，例如其键合特性和

结构稳定性，对于器件的性能和可靠性至关重要。

应力和应变，由于溅射粒子的动量传递，沉积过程会给基片引

入应力和应变。这会影响基片的机械和电气性能，特别是在内部应

力较高的薄膜的情况下。

基片加热，等离子体放电和溅射粒子的轰击会在基片上产生热

量。这种加热会影响基片的温度，并可能导致热膨胀、扩散或相变。