2023年7月25日发(作者：)

专利内容由知识产权出版社提供专利名称：Latticework with plurality of overlying lines发明人：GEORGE R. HAGNER申请号：AU3574597申请日：19970620公开号：AU3574597A公开日：19980114摘要：A circuit board fabrication method and system is disclosed in which circuitboards are fabricated by adhesively applying circuit conductive traces to a circuit boardsubstrate and subsequently affixing the arrangement of the circuit traces on thesubstrate by encapsulating and embedding the circuit traces within a circuit boardcovering material that becomes flowable and adhesive when subjected to heat andpressure. In one embodiment, the circuit traces are created and applied to circuit boardsubstrate areas by a punch and die assembly. A sheet of circuit trace material is providedbetween plates of the apparatus wherein the plates have matching circuit trace shapedcut-outs. Punch elements having a mating circuit trace shape are slidable within the cut-outs wherein a circuit trace is punched from the circuit trace material when the punchelements slide between the plates. After a circuit trace is punched, the punch elementsthen stamp the circuit trace to the substrate. Since the circuit trace material includes aconductor and an adhesive layer, the circuit traces adhesively bind to the substrateduring the circuit forming process. Further, a dielectric layer, which may be part of theadhesive layer, allows such circuit traces to be iteratively disposed on top of one anothersubstantially without concern for electrical interference at circuit trace overlaps.申请人：CIRCUITRONICS, INC.更多信息请下载全文后查看