2024年4月10日发(作者：免费3d打印模型网站)

第1页,共5页

PCB常用英文缺陷词汇汇编

Finger prints/smudge on copper foil

Wrinkled flex

Corner damage

Unsupported hole haloing

Unsupported hole haloing/slight mechanical damage

Unsupported hole haloing/severe mechanical damage

Haloing along edge

Haloing and nonmetallic burrs along edge

Delamination

Laminate voids

Laminate voids(Possible measle)

Crazing

Measle over inner layer conductor

Measled board(Board edge view)

Measle(Cross-section)

Resin starvation

Lamimate void in thermal zone

Lamimate voids/measle in thermal zone

Laminate void and resin recession

Weave texture /exposure

Surface blistering/delamination

Blistering adjacent to land

Voids

Copper foil-scratch and dent

Conductor with plating nodules

Conductor width reduction/Rough edge definition

Etched conductor

Conductor-pin hole

Pin hole in conductor

Conductor-rough edge definition

Tin/lead plating overhang

Conductor overhang

Conductor undercutting collapse

Incomplete etching

Etched conductor(land)/plating void in the hole

Shorts,extraneous copper

Peeled conductors

Scratched conductors and substrate

Scratched inner conductors and substrate

Scratched conductors exposing copper

铜面手指印/污渍

线路弯曲

板角缺损

非支撑孔白斑

非支撑孔白斑/轻微的机械损坏

非支撑孔白斑/严重的机械损坏

板边白斑

板边白斑与非金属批锋

分层,爆板

碾压空洞

碾压空洞(可能是白点)

白边

内层导体上面的白点

白点板(板边视图)

白点(切片)

树脂不足

在散热区里的碾压空洞

在散热区里的碾压空洞/白点

碾压空洞与退胶

织纹显露

表面起泡/分层

毗邻焊接块的起泡

空洞

铜箔划伤和凹痕

有电镀节点的导体

线宽减小/粗糙边缘定义

被蚀刻掉的导体

导体针孔

导体里的针孔

粗糙边缘定义导线

电镀铅悬起

导线悬起

导线削减后断线

蚀刻不完全

被蚀刻掉的导体 (焊接块)/空里电镀空洞)

短路,外来铜丝

剥离的导线

划伤的导线与基材面

划伤的内层导线与基材面

划伤的露铜导线

第2页,共5页

PCB常用英文缺陷词汇汇编

Finger prints/smudge on copper foil

Lifted land

Lifted land and corner crack

Severe lifted land, corner crack, innerlayer separation

Separation between platings

Surface contamination/electroless separation from foil

Gold contacts/Poor plating adhesion

Gold contacts/Pit,pin holes and surface nodules

Plating on printed contacts gouged

Plating on printed contacts scratched

Gold contacts Plating anomalies

Gold plating adhesion failure

Plated-through hole-solder filled

Nonwetting of hole

Poor solder fill- voids and dewetting

Complete hole fill-nonwetting top surface

Tin/lead plating after fusing

Hor Air Solder Leveled(HASL)

Solder dewetting

Conductor surface nonwetting with eposed copper

Dewetting of large plane

Conductor with dewetting,nonwetting and solder bridging

Conductor with solder dewetting and nonwetting/plus etched

conductors

Solder dewetting and nonwetting surface lands

Tin lead contamination

Misregistration

Good registration

Misregistration -no annular ring

Innerlayer misregistration

Surface misregistration in blind via

Misregistration- hole breakout

Internal foil crack

Internal foil crack/Plating cracks(barrel)

External foil crack and corner crack

Resin smear(Horizontal view)

Innerlayer separation

Copper plating- separation in plated-through hole

Innerlayer separation and rein recession

Poor plating adhesion to hole wall

铜面手指印/污渍

悬起的焊接块

悬起的焊接块和板角裂痕

严重悬起的焊接块,板角裂痕 ,内层分离

电镀分离

表面污染/在铜箔里的非电镀分离

金手指/差劲的电镀粘合力

金手指/凹痕,针孔和表面节结

在金手指上的电镀凿痕

在金手指上的电镀划伤

金手指电镀异物

电金粘合力差

镀通孔-焊接填充

孔的不可润湿性

差劲的焊接填充-空洞和去湿性

孔完全填充-上表面不可润湿

熔化后的电镀锡/铅

喷锡(热风平整)

焊接去湿

有露铜的导线表面不能润湿

大面积的去湿

有去湿,不能润湿和焊接桥接的导线

有焊接去湿与不能润湿/附加蚀刻铜线的导线

焊接去湿与不能润湿表面焊接块

锡铅污染

拍偏

良好的对准度

拍偏 -没有锡圈

内层拍偏

在盲孔里的表面拍偏

拍偏 -崩孔

内部铜箔裂缝

内部铜箔裂缝/镀层裂缝(桶状的)

外部铜箔裂缝和板角裂缝

胶渍(水平视图)

内层分离

电镀铜-在镀通孔里的分离

内层分离和退胶

孔壁电镀粘合力差

第3页,共5页

PCB常用英文缺陷词汇汇编

Finger prints/smudge on copper foil

Lifted land/Innerlayer separation/Poor plating adhesion to hole

wall/Seperation along vertical edge of external land

Plating void

Voids in hole

Nail heading

Thin area in copper plating

Plating fold, metal core board

Protruding glass fibers, wicking and plating fold

Plating nodule

Separation along vertical edge of external foil

Plating void/Barrel crack

Gross plating voids

Electroless copper

Etchback(positive)

Negative etchback

Negative etchback with plating fold and occlusion

Plating fold/Plating nodule

Taper plating

Blow hole resulting from plating void

Barrel crack

Flex barrel crack

Flex plating voids

Flxe plating voids, severe damage of flex substrate/Gross

dielectric damage

Plating crack

Corner crack

Severe corner crack

Interplane separation

Separation along edge of external foil(top arrow)/Interplane

separation (lower arrow)

Plating separation (extending beyond vertical edge of external

foil)

Plating fold,inclusion,and nodule

Plating anomaly

Horizontal microsection/Pink ring

Horizontal microsection/Plating anomaly

Machining inconsistencies

Slot (protruding fibers)

Rough edges

铜面手指印/污渍

悬起的焊接块/内层分离/孔壁电镀粘合力差/沿着外部焊接

块竖直边缘的分离

电镀空洞

孔里的空洞

钉头

在铜镀层里的薄区

镀层重叠,金属芯板

玻璃纤维,毛细和镀层重叠突起

电镀节结

沿着外部铜箔竖直边缘的分离

电镀空洞/桶状裂缝

总电镀空洞

非电镀铜

正蚀

负蚀

有电镀重叠和闭塞的负蚀

电镀重叠/电镀结节

锥形电镀

因电镀空洞而吹孔

桶状裂缝

挠性桶状裂缝

挠性电镀空洞

挠性封装底板的挠性电镀空洞,严重损坏/总的非传导性损

坏

电镀裂缝

角落裂缝

严重的角落裂缝

内层分离

沿着外部铜箔边缘的分离(上面箭头)/内层分离(下面箭头)

电镀分离(沿着外部铜箔竖直边缘延伸)

电镀重叠,夹杂物和结节

电镀异物

水平切片/分红圈

水平切片/ 电镀异物

机械矛盾

狭槽(纤维突起)

粗糙边缘

第4页,共5页

PCB常用英文缺陷词汇汇编

Finger prints/smudge on copper foil

Missing hole

Burr(drilling)

Edge condition-burrs (routing )

Nicked edge on printed contact

Twist

Bow and twist

Typical solder resist

Solder resist misregistration

Solder resist misregistration, surface mount

Solder resist blisters

Solder resist blisters/delamination

Flaking /peeling

Skip coverage-solder resist bubbles

Waves/ripples/wrinkles

Incomplete via tenting

Soda strawing

Good ink marking

Smeared marking

Impression stamp marking

Impression stamped (illegible)

Etched marking

Etched marking (missing )

Innerlayer image reversed

Wrong layup,multilayer board

Delamination(thermal zone)

Internal laminate delamination in prepreg area

Missing or discolored oxide

Pink ring

Typical flex

Typical flex (with stiffener)

Poor trimming

Typical rigid-flex

Trimming burrs

Rigid-flex anomalies(unsupported hole haloing, solder on

gold,trimming burrs,etc)

Strain relief

Foreign material in covercoat

Tape residue

Corrosion

铜面手指印/污渍

少孔

批锋(钻孔)

边缘情形-批锋(锣板)

印刷手指上的边缘刻痕

曲

板弯曲

典型的阻焊(绿油)

绿油拍偏

绿油拍偏,表面安装

绿油起泡

绿油起泡/分层

压成片/剥离

跳跃覆层-绿油起泡

起波浪/起波纹/起皱

不完全via孔封孔

碱处理粗糙

良好的水印白字

油印白字

压印白字效果

压印白字(字迹模糊的)

蚀字

蚀字(缺损)

内层图象颠倒

错误压板结构,多层板

分层(散热区)

在PP区的内部碾压分层

缺少或变色氧化

粉红圈

典型挠性板

典型挠性板(有硬物)

差劲的修整性

典型刚-挠结合板

修整性批锋

刚-挠异物(非支撑孔白斑,金上焊料,修整性批锋,等等.

张力减小

在覆盖下的异物

磁性残留物

腐蚀

第5页,共5页

PCB常用英文缺陷词汇汇编

Finger prints/smudge on copper foil

Metal core board with through-hole and blind vias

Metal core through-hole

Void in backfill dielectric material of metal core board

铜面手指印/污渍

有镀通孔和盲孔的金属芯板

通孔金属芯板

在金属芯板衬垫绝缘物质里的空洞

Blind vias

Burr on metal core

Typical flush circuit

Typical flush microsection

Uneven resin fill flush circuit

Foreign material -hair

Foreign material-stained

Surface contamination

Gross multiple problems

盲孔

在金属芯板上的批锋

典型的嵌入式电路

典型的嵌入式电切片

嵌入式电路不均匀填胶

异物-发丝

异物-污物

表面污染

总的多重问题