2024年4月16日发(作者：)

pcb双面板的工艺流程

英文回答：

PCB (Printed Circuit Board) double-sided fabrication

involves several steps in its manufacturing process. Here,

I will outline the general process flow for producing

double-sided PCBs.

1. Design and Layout: The first step is to create a

design and layout for the PCB using a computer-aided design

(CAD) software. This involves placing components, routing

traces, and creating the necessary layers for the PCB.

2. Material Selection: Once the design is complete, the

next step is to select the appropriate materials for the

PCB. This includes choosing the substrate material (usually

fiberglass-reinforced epoxy), copper foil for the

conductive layers, and solder mask materials.

3. Substrate Preparation: The substrate material is cut

into the desired size and shape for the PCB. It is then

cleaned and prepared for the subsequent processes.

4. Copper Cladding: Copper foil is laminated onto both

sides of the substrate using heat and pressure. This

provides the conductive layers for the PCB.

5. Imaging: A photosensitive material called a

photoresist is applied to both sides of the copper-clad

substrate. The PCB design is then transferred onto the

photoresist using a UV light source and a photomask. The

areas exposed to light become either the conductive traces

or the pads for component attachment.

6. Etching: The unexposed areas of the photoresist are

removed, leaving behind the desired conductive traces and

pads. The exposed copper is then etched away using an

etching solution, leaving only the desired copper pattern

on the substrate.

7. Drilling: Holes for component mounting and

interconnections are drilled into the PCB using a precision