2024年4月11日发(作者：)

溅射镀膜机操作流程

英文回答：

Sputtering Deposition Machine Operation Procedure.

1. Pre-deposition Preparation.

Prepare the substrate by cleaning and etching it to

remove any contaminants.

Mount the substrate onto the sample holder.

Load the substrate holder into the deposition

chamber.

Close the deposition chamber and evacuate it to the

desired vacuum level.

Introduce the desired gases into the chamber and

adjust the flow rates.

2. Deposition Process.

Ignite the plasma by applying a voltage between the

target and the substrate.

The plasma will bombard the target, causing it to

sputter material onto the substrate.

Control the deposition parameters, such as the

plasma power, gas pressure, and deposition time, to achieve

the desired film properties.

3. Post-deposition Processing.

Allow the film to cool down before opening the

deposition chamber.

Remove the substrate holder from the chamber.

Characterize the deposited film using appropriate

techniques.

中文回答：

溅射镀膜机操作流程。

1. 沉积前准备。

清洁和蚀刻基片以去除任何污染物。

将基片安装到样品架上。

将样品架装入沉积室。

关闭沉积室并将其抽真空至所需真空度。

将所需气体引入腔室并调整流量。

2. 沉积过程。

通过在靶材和基片之间施加电压点燃等离子体。

等离子体将轰击靶材，使其溅射材料到基片上。

控制沉积参数，例如等离子体功率、气压和沉积时间，以获

得所需的薄膜性能。

3. 沉积后处理。

在打开沉积室之前让薄膜冷却。

从腔室中取出样品架。

使用适当的技术表征沉积薄膜。