2024年4月16日发(作者：)

IPC标准清

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英文名称

IPC-T-50G Terms and Definition for Interconnecting and Packaging

Electronic Circuits

IPC-TM-650 Test Methods Manual

IPC/EIA J-STD-001C Requirements for Soldered Electrical &

Electronic Assemblies

IPC/EIA J-STD-002B Solderability Tests for Component Leads,

Terminations, Lugs, Terminals and Wires

IPC/EIA J-STD-003A Solderability Tests for Printed Boards

IPC/EIA J-STD-004A Requirements for Soldering Fluxes

IPC/EIA J-STD-005A Requirements for Soldering Pastes

IPC-A-610D Acceptability of Electronic Assemblies

IPC-A-600F Acceptability of Printed Boards

IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of

Moisture/Reflow Sensitive Surface Mount Devices

IPC-7711/21A

IPC-9701 Performance Test Methods and Qualification Requirements

for Surface Mount Solder Attachments

IPC-CC-830B Qualification and Performance of Electrical Insulating

Compound for Printed Wiring Assemblies

IPC-7525 Stencil Design Guidelines

IPC-7351 General Reqirements for Surface Mount Design and Land

Pattern Standerd

IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire

Harness Assemblies

IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls

IPC-M-108 Cleaning Guides and Handbook Manual

IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What

Does It Tell Us?

IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies

IPC-SC-60A Post Solder Solvent Cleaning Handbook

IPC-SA-61A Post Solder Semi-aqueous Cleaning Handbook

IPC-AC-62A Aqueous Post Solder Cleaning Handbook

IPC-TR-476A Electrochemical Migration: Electrically Induced Failures

in Printed Circuit Assemblies

IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --

Low Solids, Fluxes and Pastes Processed in Ambient Air

IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing

IPC-9201 Surface Insulation Resistance Handbook

IPC-M-109 Component Handling Manual

IPC-DRM-18G Component Identification Desk Reference Manual

IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk

Reference Manual

IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference

Manual

IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface

Mount Attachments

IPC-PD-335 Electronic Packaging Handbook

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IPC-QL 365A Certification of Facilities That Inspect/Test Printed

Boards, Components and Materials

IPC-MI-660 Incoming Inspection of Raw Materials Manual

IPC-HDBK-005 Guide to Solder Paste Assessment

IPC-HDBK-830 Guideline for Design, Selection and Application of

Conformal Coatings

IPC-7530 Guidelines for Temperature Profiling for Mass Soldering

(Reflow & Wave) Processes

IPC-TP-1115 Selection and Implementation Strategy for a Low-

Residue No-Clean Process

IPC-S-816 SMT Process Guideline & Checklist

IPC-CM-770E Component Mounting Guidelines for Printed Boards

IPC-9850-K Surface Mount Placement Equipment Characterization-KIT

IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface

Mount Placement Equipment Standardization

• 4 IPC-9850 Placement Accuracy Verification Panels

• 1 IPC-9850 CMM Measurement Verification Panels

• 150 IPC-9850 QFP-100 Glass Components

• 130 IPC-9850 QFP-208 Glass Components

• 150 IPC-9850 BGA-228 Glass Components

• NIST Traceable Measurement Certificate

• Custom Storage Case

IPC-TR-464 Accelerated Aging for Solderability Evaluations

SMC-WP-001 Soldering Capability White Paper Report

SMC-WP-005 PCB Surface Finishes

IPC:Association Connecting Electronics Industries(电子制造协会),

Institute of the Interconnecting and Packing Electronic Circuit”(电子电路互连与封装协会)逐步发展