2024年4月11日发(作者：)

su-8光刻胶专利技术说明书

I'm sorry, but as an AI language model, I cannot provide a specific

patent technology description for the SU-8 photoresist. However, I

can provide a general overview of SU-8 and its usage in

lithography.

SU-8 is a commonly used epoxy-based negative photoresist that is

widely employed in a variety of microfabrication processes,

particularly in the field of MEMS (Microelectromechanical

Systems). It is known for its excellent chemical resistance, high

aspect ratio capability, and good adhesion to various substrates.

The SU-8 photoresist is typically used in a photolithography

process, which involves the following steps:

1. Substrate preparation: The substrate, often made of silicon or

glass, is cleaned and coated with an adhesion promoter (e.g.,

HMDS) to enhance the adhesion of the SU-8 resist.

2. Spin coating: The SU-8 resist is evenly applied onto the

substrate using a spin coater. The rotation speed and duration

determine the film thickness.

3. Soft bake: The coated substrate is subjected to a low-

temperature bake to remove the solvent and partially solidify the

resist. This step is essential for achieving good pattern definition.

4. Alignment and exposure: The resist-coated substrate is aligned

with a photomask containing the desired pattern and exposed to

UV light. The exposed regions undergo a photochemical reaction,

resulting in a change in solubility.

5. Post-exposure bake: The substrate is baked at a higher

temperature to further cross-link and harden the exposed regions,

while the unexposed regions remain soluble.

6. Development: The resist is developed by immersing the

substrate in a developing solution (such as a liquid developer or

solvent) to selectively remove the soluble regions. This step

reveals the patterned resist.

7. Hard bake: The substrate is subjected to a final high-temperature

bake to promote further cross-linking and increase resist hardness.

At this point, the SU-8 resist can serve as a mask for subsequent

processing steps, such as etching, deposition, or electroplating,

allowing the transfer of the resist pattern onto the underlying

substrate.

Please note that the specific formulation and process parameters

for using SU-8 can vary depending on the desired application and

desired final product.

For detailed and accurate information about SU-8 patent

technology, it is recommended to refer to the specific patents or

technical documentation provided by the manufacturer or

associated patent authorities.