2024年4月16日发(作者：)

IPC-M-105 Rigid Printed Board Manual

刚性印制板设计手册

IPC-D-325A Documentation Requirements for Printed Boards

印制板设计文件图册要求IPC-PE-740A Troubleshooting for Printed Board

Manufacture and Assembly

印制板制造和组装的故障排除

IPC-6010 Series IPC-6010 Qualification and Performance Series

IPC-6010印制电路板质量标准和性能规范系列手册

IPC-6011 Generic Performance Specification for Printed Boards

印制板通用性能规范

IPC-6013A Qualification & Performance Specification for Flexible Printed

Boards (Includes Amendment 1)

挠性印制板的鉴定与性能规范（包括修改单1）

IPC-6016 Qualification & Performance Specification for High Density

Interconnect (HDI) Layers or Boards

高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and

Performance Specification for Rigid Printed Boards, Includes Amendment 1

刚性印制板的鉴定与性能规范 (包括修改单1)

IPC-6018A Microwave End Product Board Inspection and Tech

微波成品印制板的检验和测试

IPC-6015 Qualification & Performance Specification for Organic Multichip

Module (MCM-L) Mounting and Interconnections

有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范

IPC-A-600F Acceptability of Printed Boards

印制板验收条件

IPC-QE-605A Printed Board Quality Evaluation Handbook

印制板质量评价

IPC-QE-605A-KIT Hard Copy and CD

印制板质量评价书和光盘(CD)

IPC-HM-860 Specification for Multilayer Hybrid Circuits

多层混合电路规范

IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed

Boards

聚合物厚膜印制板的鉴定与性能

IPC-ML-960 Qualification and Performance Specification for Mass Lamination

Panels for Multilayer printed Boards

多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范

IPC-TR-481 Results of Multilayer Tests Program Round Robin

多层印制板联合试验计划结果

IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and

Interconnecting Electronic Components

用于电子元件安装与互连的印制板质量评价

IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated

Through Holes in PCBs

印制板中小直径镀覆孔可靠性评价联合试验

IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for

Printed Circuit Boards

印制电路板表面非电镀镍/沉金规范

IPC-DR-572 Drilling Guidelines for Printed Boards

印制板钻孔导则

IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias

印制板通孔机加工方案的改进和优选手册

IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers

钻床和铣床用计算机数字控制格式

IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines

施加阻焊前及施加后清洗导则

IPC-HDI-1 High Density Interconnect Microvia Technology Compendium

高密度(HDI)互连微通孔技术纲要

IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia

Materials

高密度互连(HDI)及微导通孔材料规范

IPC-6016 Qualification & Performance Specification for High Density

Interconnect (HDI) Layers or Boards

高密度互连(HDI)层或印制板的鉴定与性能规范

IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design

Examples for Build-Up/High Density Interconnection

积层/高密度互连的术语和定义、试验方法与设计例

IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric

Materials for Multichip Modules

多芯片组件内层有机绝缘材料的鉴定试验

IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I,

Round 1

高密度印制板微通孔评价指标手册, 第一期第一版

IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2

高密度印制板微通孔评价指标手册, 第一期第二版

IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3

高密度印制板微通孔评价指标手册, 第一期第三版

IT-98123 Microvia Manufacturing Technology Cost Analysis Report

微通孔制作技术成本核算报告

IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design

控制阻抗电路板与高速逻辑设计

IPC-2252 Design Guide for RF/Microwave Circuit Boards

射频/微波电路板设计指南

IPC-4103 Specification for Base Materials for High Speed/High Frequency

Applications

高速高频用基材规范

IPC-6018A Microwave End Product Board Inspection and Test

微波成品印制板的检验和测试

IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed

Techniques

采用高速技术电子封装设计导则

IPC-M-102 Flexible Circuits Compendium

挠性电路纲要

IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry

挠性印制线路用挠性绝缘基底材料

IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible

Printed Circuitry and Flexible Adhesive Bonding Films

挠性印制线路覆盖层用涂粘接剂绝缘薄膜

IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible

Printed Circuitry

挠性金属箔去电应用于柔性电路组装

IPC-6013-K Qualification & Performance Specification for Flexible Printed

Boards & Amendment 1

挠性印制板的鉴定与性能规范（包括修改单1）

IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and

Double-Sided Flexible Printed Wiring Boards

IPC/JPCA单双面挠性印制板性能手册

IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits

单面和双面挠性电路组装导则

IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring

Boards

印制线路板复合金属材料规范

IPC-MB-380 Guidelines for Molded Interconnection Devices

模压互连器件导则

IPC-M-107 Standards for Printed Board Materials Manual

印制板材料标准手册

IPC-MI-660 Incoming Inspection of Raw Materials Manual

原材料接收检验手册

IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed

Boards

刚性及多层印制板用基材规范

IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed

Wiring Board Applications

多层印制板用芯板结构选择导则

IPC-4562 Metal Foil for Printed Wiring Applications

印制线路用金属箔

IPC-CF-148A Resin Coated Metal for Printed Boards

印制板用涂树脂金属箔

IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring

Boards

印制线路板复合金属材料规范

IPC-TR-482 New Developments in Thin Copper Foils

薄铜箔的新发展

IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study

IPC铜箔延展性联合研究结果

IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study

铜箔断裂强度试验联合研究结果

IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed

Boards

“E”类精纺玻璃纤维层印制板技术规范

IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass

Materials

E 玻璃纤维非织布材料规范及性能确定方法

IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose

Based Paper for Printed Boards

印制板用纤维纸规范及性能确定方法

IPC-4411-K Specification and Characterization Methods for Non-Woven

Para-Aramid Reinforcement, with Amendment 1

聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1

IPC-4411-AM1 Specification and Characterization Methods for Non-Woven

Para-Aramid Reinforcement, Amendment 1

关于聚芳基酰胺非织布规范及性能确定方法的修改单 1

IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed

Boards

印制板用经处理S玻璃纤维织物规范

IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed

Boards

印制板用经处理聚芳酰胺纤维编织物规范

IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused

Silica) for Printed Boards

印制板用经处理石英（熔融纯氧化硅）纤维编织物规范

IPC-2524 PWB Fabrication Data Quality Rating System

印制板制造数据质量定级体系

IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability

Benchmark Test Standard and Database

印制板工艺, 容量, 质量,可靠性试验标准和数据库

IPC-9191 General Guidelines for Implementation of Statistical Process Control

(SPC)

实施统计过程控制(SPC)的通用导则

IPC-9199 Statistical Process Control (SPC) Quality Rating

统计分析控制

IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated

Printed Boards

未组装印制板电测试要求和指南

IT-97061 PWB Hole to Land Misregistration: Causes and Reliability

印制线路板通孔与焊盘的错位: 原因和可靠性

IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in

Thick Panels

多层板内部无焊盘层互连错位的可靠性

IPC-MS-810 Guidelines for High Volume Microsection

大批量显微剖切导则

IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards,

Components & Materials

印制板、元器件及材料检验试验设备的认证

IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1

& 2 International Round Robin Test

薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告

IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations

for Inner-Layer Separation

内层分离的互连应力测试(IST)与显微剖切相关性联合研究