2024年4月16日发(作者：)

IPC-A-610C Acceptability of Electronic Assemblies

印制板组装件验收条件

IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits

电子电路互连与封装的定义和术语

IPC-S-100 Standards and Specifications Manual

标准和详细说明汇编手册

IPC-E-500 IPC Electronic Document Collection

已出版的IPC标准电子文档资料合订本

IPC-TM-650 Test Methods Manual

试验方法手册

IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program

静电释放控制过程(由静电释放协会制定)

IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies

电气与电子组装件锡焊要求

IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1

J-STD-001辅助手册及指南及修改说明1

IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C Comparison

IPC-610手册和指南(包括IPC-A-610B和C的对比)

IPC-EA-100-K Electronic Assembly Reference Set

电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。

IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

电缆和引线贴装的要求和验收

IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology

倒装芯片及芯片级封装技术的应用

IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation

芯片直装技术实施导则

IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications

倒装芯片用半导体设计标准

J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

FC（倒装片）和CSP(芯片级封装)的外形轮廓标准

IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps

倒装芯片及芯片级凸块结构的性能标准

SMC-WP-003 Chip Mounting Technology

芯片贴装技术

J-STD-013 Implementation of Ball Grid Array and Other High Density Technology

球栅阵列 (BGA)及其它高密度封装技术的应用

IPC-7095 Design and Assembly Process Implementation for BGAs

球栅阵列的设计与组装过程的实施

IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls

BGA球形凸点的标准规范

IT-98000 JPL Chip Scale Packaging Guidelines

JPL 发布的CSP导则

注：IT (The California Institute of Technology)

JPL (The Jet Propulsion Laboratory)

IT-98080 JPL Ball Grid Array Packaging Guidelines

JPL 发布的BGA封装导则

IT-98093 ITRI Chip Carrier, Phase 1 Report

ITRI 关于芯片载体的报告

ITRI (The Interconnect Technology Research Institute)

IPC-MC-790 Guidelines for Multichip Module Technology Utilization

多芯片组件技术应用导则

IPC-M-108 Cleaning Guides and Handbook Manual

清洗导则和手册

IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?

电路板离子洁净度测量：它告诉我们什么？

IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies

印制板及组装件清洗导则

IPC-SC-60A Post Solder Solvent Cleaning Handbook

锡焊后溶剂清洗手册

IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook

锡焊后半水溶剂清洗手册

IPC-AC-62A Aqueous Post Solder Cleaning Handbook

锡焊后水溶液清洗手册

IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed

Circuit Assemblies

电化学迁移：印制电路组件的电气诱发故障

IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results

清洗及清洁度试验计划1阶段试验结果

IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed

IPC第3阶段非清洗助焊剂研究

IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing

深入离子洁净度测试

IPC-9201 Surface Insulation Resistance Handbook

表面绝缘电阻手册