2024年4月11日发(作者：)
专利内容由知识产权出版社提供
专利名称：Process for packaging components, and
packaged components
发明人：Juergen Leib
申请号：US10580284
申请日：20041115
公开号：US07700397B2
公开日：20100420
专利附图：
摘要：A wafer level packaging process for packaging components is provided. The
process includes permanently connecting a functional side of a base substrate to a
covering substrate at wafer level so that a plurality of functional regions on the
functional side are in each case packaged to form a wafer level package, the plurality of
functional regions being spaced apart from one another on the functional side; producing
contact-connection recesses in the base substrate to uncover contact surfaces on the
base substrate from a back surface of the base substrate; dividing the base substrate
into body regions and connection regions; thinning the body regions or the connection
regions until the wafer level package has different thicknesses in the body regions and
the connection regions; and dicing wafer level package into chips along predefined
cutting lines between the plurality of functional regions.
申请人：Juergen Leib
地址：Freisingen DE
国籍：DE
代理机构：Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
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