Piezoelectric substrate fabrication process

Piezoelectric substrate fabrication process


2024年4月11日发(作者:)

专利内容由知识产权出版社提供

专利名称:Piezoelectric substrate fabrication process

发明人:Raymond G. Capek,Ann A. Koss,Frank T.

Takahashi

申请号:US05/784293

申请日:19770404

公开号:US04078284A

公开日:19780314

摘要:A method of fabricating a lead titanate piezoelectric surface acoustic wave

substrate comprises combining lead oxide, titanium tetra-n- butoxide, lanthanum oxide,

and manganese dioxide, with a hydrocarbon solvent and adding water to the combination

to form a slurry in which titanium polyester is precipitated unto the lead oxide and

lanthanum and manganese oxides. The slurry is dried by heating to a temperature

sufficient to remove the liquids therefrom but below the temperature at which an

exothermic reaction between the included hydrogen, oxygen and carbon occurs. A first

calcining operation produces the exothermic reaction and forms lead titanate after which

the lead titanate is heated to and maintained at a temperature above that produced by

the exothermic reaction. The lead titanate is then ground to produce powdered lead

titanate and a second calcining is carried out to produce structural annealing of the

powdered lead titantate. Binder materials are added and the combination of powdered

lead titanate and binder materials is cold- pressed into substantially planar substrates.

After removal of the binders by heating, the substrates are fired to reduce porosity and

poled to impart a piezoelectric characteristic.

申请人:ZENITH RADIO CORPORATION

代理人:Nicholas A. Camasto,Roy A. Ekstrand

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