2024年4月11日发(作者：)

灯珠铝基板的制造过程及工艺探析

The process for manufacturing LED aluminum substrates involves

several steps. First, the aluminum substrate is prepared by cleaning

and degreasing it to remove any impurities. Then, a layer of

dielectric material, such as ceramic or epoxy, is applied to the

surface of the substrate. This dielectric layer acts as an insulator

and helps to improve the thermal conductivity of the substrate.

Next, the circuit pattern is created on the dielectric layer

using a process called lithography. This involves applying a

photosensitive material, known as a resist, onto the dielectric

layer and exposing it to UV light through a photomask. The areas

of the resist that are exposed to light become soluble, while the

areas covered by the mask remain insoluble. The soluble areas are

then washed away, leaving behind the desired circuit pattern.

After the circuit pattern is created, the substrate goes through

a process of etching, where a chemical solution is used to remove

the exposed dielectric material. This creates the channels and

cavities necessary for placing the LED chips and other electronic

components.

Once the etching process is complete, the substrate is cleaned

again to remove any remaining resist and etching solution. Then,

the LED chips are placed onto the substrate and connected to the

circuit pattern using wire bonding or flip chip technology. Finally,

the assembled substrate undergoes testing and quality control

checks to ensure its functionality and reliability.

中文回答：

制造LED铝基板的工艺流程包括几个步骤。首先，铝基板经过清洗和

脱脂处理，以去除任何杂质。然后，在基板表面涂覆一层介电材料，如陶

瓷或环氧树脂。这层介电层起到绝缘作用，并有助于提高基板的导热性能。

接下来，使用光刻工艺在介电层上创建电路图案。这涉及将一种称为

光刻胶的光敏材料涂在介电层上，并通过光掩膜通过紫外光照射。光照射

的区域变得可溶，而被掩膜覆盖的区域保持不溶。可溶区域随后被清洗掉，

留下所需的电路图案。

电路图案创建完成后，基板经过蚀刻过程，使用化学溶液去除暴露的

介电材料。这样可以形成放置LED芯片和其他电子元件所需的通道和空腔。

蚀刻过程完成后，再次清洗基板以去除任何剩余的光刻胶和蚀刻溶液。

然后，将LED芯片放置在基板上，并使用线键合或翻转芯片技术连接到电

路图案上。最后，组装完成的基板经过测试和质量控制检查，以确保其功

能和可靠性。