2024年4月11日发(作者：)

化学镀ni工艺流程

英文回答：

Electroless Nickel Plating Process.

Electroless nickel plating is a chemical process that

deposits a nickel-phosphorus alloy onto a substrate without

the use of an electric current. This process is widely used

in the electronics industry to provide corrosion protection,

wear resistance, and solderability to printed circuit

boards (PCBs) and other electronic components.

The electroless nickel plating process involves the

following steps:

1. Substrate Preparation: The substrate is cleaned to

remove any oils, greases, or other contaminants that could

interfere with the plating process. This is typically done

through a series of cleaning steps, including degreasing,

acid etching, and rinsing.

2. Activation: The substrate is activated to create a

surface that is receptive to the electroless nickel plating

solution. This is typically done by immersing the substrate

in a solution of palladium chloride and hydrochloric acid.

3. Plating: The substrate is immersed in an electroless

nickel plating solution. This solution contains nickel ions,

reducing agents, and complexing agents. The reducing agents

cause the nickel ions to be deposited onto the substrate,

while the complexing agents prevent the nickel from

precipitating out of solution.

4. Post-Treatment: After plating, the substrate is

typically rinsed and dried. Additional post-treatment steps

may include heat treatment to improve the properties of the

nickel-phosphorus alloy coating.

The electroless nickel plating process is a versatile

and cost-effective way to apply a nickel-phosphorus alloy

coating to a variety of substrates. This process is widely

used in the electronics industry, but it can also be used

in other applications, such as automotive, aerospace, and

medical.

中文回答：

化学镀镍工艺流程。

化学镀镍是一种在基底上沉积镍磷合金的化学工艺，不需要使

用电流。该工艺广泛用于电子工业，为印刷电路板 (PCB)和其他电

子元件提供防腐蚀、耐磨损和可焊性。

化学镀镍工艺包括以下步骤：

1. 基底准备，清洁基底以去除任何可能干扰镀层工艺的油脂或

其他污染物。这通常通过一系列清洁步骤进行，包括脱脂、酸蚀刻

和冲洗。

2. 活化，活化基底以创建对化学镀镍溶液具有吸收性的表面。

这通常通过将基底浸入氯化钯和盐酸溶液中来完成。

3. 镀层，将基底浸入化学镀镍溶液中。该溶液包含镍离子、还

原剂和络合剂。还原剂使镍离子沉积在基底上，而络合剂防止镍从

溶液中沉淀出来。

4. 后处理，镀层后，通常冲洗和干燥基底。附加的后处理步骤

可能包括热处理以改善镍磷合金涂层的性能。

化学镀镍工艺是一种通用且经济高效的方法，可将镍磷合金涂

层施加到各种基底上。该工艺广泛用于电子工业，但也可用于其他

应用，如汽车、航空航天和医疗。