2024年3月13日发(作者：)

英文简称

0 Acc/1 Rej

2/O

4-state

5M1E

5W1H

70nm

8D report

ABL

Adir

ADM

AMS

AND

ASE

ASY

ASL

ATA

Athens

AQL

AMS

AP

AR

ACC

ABM

ABB

ABC

APS

APQP

AHU

AWB

ALP

ASP

AVL

ASY-WIP

AVR

ATP

英文全稱

0 defect is Accepted and 1 or more defect is

Rejected

2ed optical inspection

4 states of threshold in MLC. Can store 2 bits of

information (00,01,10,11)

Man machine Material Method Measure

Environment

When where who what why how

70 nanometer min. feature size. 0.07 micrometer

8 Discipline report

中文名稱

0收1退

二光目视

Cell的4个状态

人机物法环

5W1H

70纳米

8D

报告*

全球通用CAR

格式*

ABL

Adir

行政管理处

配件管理系统

All bit line memory architecture

USB controller

General Administration Division

Accessory Management System

Reference to design architecture and cell (Hitachi-

AND

type cell)

ASE device assembly house, Kaohsuing, Taiwan ASE Taiwan

Assembly Operation

封装部

Approved supplier list

合格供应商清单

Advanced technology Attachment. Protocol for

ATA, 扩展型

PC cards

ARC based controller for CF and 3B with NAND

Athens

1.3 micron memory

Acceptance Quality Level

可接收品质水准

Accessory Management Section

配件管理

Account Payable

应付账款

Account Receivable

应收账款

Accountant Department

财务部

Activity-Base Management

作业成本管理

Activity-Based Budgeting

实施作业预算制度

Activity-Based Costing

作业成本制度

Advanced Planning and Scheduling

先進規畫與排程系統

Advanced Production Quality Planning

产品质量先期计划

Air Handle Unit

空调箱

Airway Bill

航运收据

Algorithmic Pattern Generator

演算模式發生器

Application Service Provider

應用程式服務供應商

Approved Vendor List

认可的供应商名单

Assembly-Work In Process

組裝物流系統

Automatic Voltage Regulator

稳压电源

Available To Promise

可承諾量

AOQ

BG

BGA

BIB

Blade

Bluetooth

BPO

BPP

BST

Bad Die

Bake

Bake Oven

BOM

BTF

BTO

BI

BIB

BTS

BI OVEN

BPR

BP

Bump

CAL

CAPA

Cassette

C&B

CCB

CDG

CF

Average Outgoing Quality

Back Grinding

Ball grid array

Burn-in Board

Dicing Blade

Short range wireless local area network standard

Bond pad opening

Bond pad pitch

Ball shear test

Bad Die

Bake

Bake Oven

Bill Of Material

Build To Forecast

Build To Order

Burn-in

Burn-in Board

Burn-in board Test station

Burn-in Oven

Business Process Reengineering

Bussiness Planning Section

gold Bump, solder Bump

Ball size

Ball/wire neck

Blue tape

Bonding diagram

Bowing up

Bristle Brush

Bubble

Buy-off

Bond power

Calibration

Corrective and preventive action

Wafer Cassette, metal Cassette

Compensation & Benefit

Change control board

Celestica Dongguan, China

Compact Flash

平均出货质量

背面研磨

球栅阵列封装

老化测试板

切割刀

蓝牙

焊盘尺寸

焊盘间距

焊球推力测试

不良芯片

烘烤

烤箱

物料清单

计划式生产

订单式生产

老化测试

老化测试板

老化测试站

老化测试炉

业务流程在设计

业务计划科

凸块

焊球直径

引线线颈

蓝膜

焊线图

上翘

清模刷

起泡

验收

焊接超声功率

校准

纠正与预防措施

晶圆盒

员工福利

更改控制委员会

Celestica 公司

CF

CGST

Chipping

Chop

CMC

COB

CRD

Charge gain stress test

Surface, bottom, side, Chipping

Term applied to a memory that has been “cut”

down from a higher capacity

Calibration Management Center

Chip on board assembly

CGST

碎裂

降级

校仪中心

COB

配置文件

Cruzer

仪校科

校准时钟效用板

校准设备介面板

产能需求规划

中心技术部

陶瓷引線晶片承載系統

通道

軟膠覆晶

玻璃覆晶

芯片级封装

晶粒盘

CP物流系統

无尘室

压缩空气

计算机辅助设计

工程资讯部

轉動測試選紐

冷却塔

校正措施報告

验证

腐蚀

成本控制

合同制造商

盘点

CP资讯系统

破裂

标准

要经法

十字路

客户导向组织

顾客导向流程

Configuration requirements document

SanDisk USB Drive. Cruzer mini, Cruzer micro,

Cruzer

Cruzer titanium

CMC Calibration Management Center

CAL-CUB Calibration-Clock Utility Board

CAL-DIB Calibration-Device Interface Board

CRP Capacity Requirements Planning

CE Center Engineering Department

CLCC Ceramic Leadless Chip Carrier

Channel Channel

COF Chip On Film

COG Chip On Glass

CSP Chip Scale Package

Chip tray Chip tray

CP-WIP Circuit Probing-Work In Process

Clean Room Clean Room

CDA Compress Dry Air

CAD Computer Aided Design

CIM Computer Integration Manufacture Department

CTO Converter Test Option

CT Cooling Tower

CAR Corrective Action Report

CORR. Correlation

Corrosion Corrosion

CM Cost Management

CM Contract manufacture

Counting Counting

CPIS CP Information System

Crack Crack

Criteria Criteria

CPM Critical Path Method

Cross L. Cross line

CFO Customer Focused Organization

COP Customer Oriented Process

CS

C/T

Dam

D.R.

DT

Date Code

客服部

周期

废料箱

受损

數據保持力

资料转换

週期碼

直流測試與可程式電源供

DPU DC Test & Programmable Power Supply

應

DSS Decision Support System

决策支持系统

Dept. Department

部，部门

DFMEA Design FMEA

设计实效模式与效应分析

DMT Design Maturing Testing

成熟度验证

DPPM Defective parts per million

每百万零件的次品数

DA Die Attach

贴片：贴片工艺

Dam Damage

损伤

DTSOP TSOP containing 2 memory die DTSOP

DC_erase Charge gain or loss from cell due to voltage fields DC_erase

DST Die shear strength

芯片推力测试

DPPO Defective parts per opportunity

产品的缺陷数

DO Day orders

当天有效订单

DOE Design of Experiments

实验设计

DRO Design Responsible Organization

具有設計职責的組織

DVT Design Verification Testing

设计验证

DM De-taping Mount

撕贴片

Device Device

型号， 元件

DPS Device Power Supply

设备供应电源

Device Type Device Type

產品型號

Dut Device under test

測試物

Blade dicing Blade

切割刀

Dicing Dicing saw

切割

Die Die

晶粒

Diff Difference

差异

DL Direct Labor

直接人员

DLT Dynamic Life Testing

动态寿命测试

DW Wafer saw

芯片切割

Device Package Types

其间封装类型

DI Wafer

去离子水

Die tilt

芯片倾斜度

Dry Box

干燥箱

Customer Service Department

Cycle Time

Cull box

Damage

Data Retention

Data Transform

Date Code

Disc

Dispose/hand

le

DRP

Div.

ECR/N

DCC

Disc

Dispose/handle

磁碟

处置

Distribution Resource Planning

運銷資源計劃

Division

處

Document & Engineering Change Request/Notice

文件及工程變更申請/通知

Document Control Center

文管中心課

雙倍數據速率同步動態記

DDR SDRAM Double Data Rate SDRAM

憶體

Down Down

当机

Download Download

下载

DBR Drum-Buffer-Rope

限制驅導式排程法

DCP Dry Coil Pump

干盘泵

DIMM Dual In-line Memory Module

雙列直插式存儲模組

Dummy

Dummy Wafer

報廢的晶片

Wafer

EFF efficiency

效率

ECN Engineering change notice 工程变动通知

ECO Engineering change order (same as ECN)

工程变更单

ECR/N Engineering Change Request/Notice

工程变更申请或通知

ERD Engineering response document 工程响应文件

ER Employee Relationship

员工关系

ERS Electric Quality Control

电性测试

EMC Electric Magnetic Capability 電磁相容

EQC Electric Quality Control

電性抽測

EDI Electronic Data Interchange

電子資料交換

EFA Electronic Failure Analysis 電性失效分析

E-FAB Electronic-Fabrication

電子化工廠資訊系統

ESD Electro-Static Discharge

靜電放電

ECRS Eliminate Combine Rearrange Simplify 取消,合併,重組,簡化

Ending lot Ending lot

結批

EAMS Engine & Accessory Management System

機台及零件管理系統

ENG Engineering 工程

ES Engineering Support

工程支援

ERP Enterprise Resource Planning

企業資源計劃

EMS Environment Management System 環境管理系統

ET Expansile Tank

膨胀水箱

Ejector Pin

顶针

Epoxy 环氧树脂

EDO RAM Extended Data Out RAM

扩展资料输出記憶體

F/C Flip Chip

覆晶

FA

FAC

FCT

FCT2

Flash drive

FLEX

FM

FMEA

FOV

FCU

FRD

FW

FFU

FPM RAM

FQC

FT-CIM

FT-WIP

FIN

FD

FBGA

FGI

FIFO

Fa

Flow

Tape

FCST

Foundry

FOB

Fuse

GR&R

GC

GIP

Grounded

GL

Bump

Good Die

Failure Analysis

失效分析

Facility Department

廠務部

Functional test. Performed immediately after SMT

功能测试

assembly (sample only)

Functional test on the PCBA at one time FCT2

2.5 inch or 3.5 inch disk drive form factor solid

Flash drive

state memory drive

Flextronics, Xixiang, China

伟创立公司

Foreign Material

外来物

Failure Mode and Effect Analysis

失效模式和效应分析

Final Outgoing Visual Inspection

出货外观检查

Fan Coil Unit

风机盘管

Financial response document

财务反应文件

Firmware

韧键

Finger cots

指套

Flick Test

脱球测试

Fan Filter Unit

风扇过滤单元

Fast Page Mode RAM

快速頁面模式記憶體

Final Quality Control

最終(成品)品質管制

Final Test Computer Integration Manufacture

FT計算機整合製造

Final Test-Work In Process

FT物流系統

Financial Department

財務部

Financial Division

財務處

Fine-Pitch Ball Grid Array

精細球柵陣列

Finished Goods Inventory

成品倉

First In First Out

先進先出

Fix Assets

固定資產

Flow

站別

Foil tape

膠膜

Forecast

預估

Foundry

晶圓代工廠

Free On Board

離岸價格

Fuse

保險絲

量測器具的重複性與再現

Gage Repeatability & Reproductivity

性

(Generic) Card test inventory Generic测试卡库存

Geographically integrated partner

Grounded

接地

General Ledger 總帳

gold Bump, solder Bump

凸塊

Good Die

良數

Grinding Grinding

Grinding

Grinding wheel

wheel

Gross Die Gross Die

GDPW Gross Die Per Wafer

GT group technology

GUA Guard Section

Handler Handler

HAST Highly Accelerated Stress Test

Hermon ARC based controller for serial products

Hermon

Latest revision of Hermon controller

rev_F

Hermon UMC UMC fabricated Hermon. Latest revision is rev_B

Reduced size Hermon controller. Pads on two

Hermon 1X

sides only

HTST High Temperature Storage Test

HD Handling Cost

H/W Hardware

H-Bar H-Bar

HE Heat Exchanger

HEPA High Efficiency Particulate Air filter

Hold Lot Hold Lot

HV House Vacuum

HR Human Resource Department

HRD Human Resource Development

HRP Human Resource Planning

HRM Human Resources Management

Idle Idle

IDD Supply current

Collective name for all flash drives using IDE

IDE cards

protocol (similar to ATA)

IMC Intermetallic

ITD Information Technology Department

I&E Import & export Section

IQC Incoming Quality Control

IND L. Index line

IDL Indirect Labor

IE Industrial Engineering Section

II Information Integrate System

IT Information Technology Division

ISAR Initial Sample Approval Request

INK INK

研磨

磨石

總測試數

每片晶圓測試Die總數

群組技術

保安課

分類機

加速温湿度压力测试

Hermon

Hermon rev_F

Hermon UMC

Hermon 1X

高温存贮测试

搬運成本

硬件

H型柵

热交换器

高效微粒空气过滤器

停止測試批

中央集尘

人力資源部

人力资源开发

人力资源计划

人力资源管理

待料

补充电流

IDE cards

金属间化合物

资讯技术部

關務課

進料品質管制

索引線

间接人员

工業工程課

資訊整合系統

資訊技術處

首批樣品認可

墨點

INK Shift

IPQC

IC

IM

ICAR

IATF

IEC

ISO

IOP

JEDEC

JIT

Kerf

Keyboard

Kit

KM

Label

LSR

L/S

LGA

Leader

LTO

LP

LTC

LUC

L/C

LD

Loader/unloa

der

LOG

Loss

LRR

MB

M/C

MCO

MCP

MDDS

INK Shift

In-Process Quality Control

Integrated Circuit

Integrated Manufacturing

Internal Corrective Action Request/Report

International Automotive Task Force

International Electrotechnical Commission

International Organization For Standardization

Involvement of People

Inspection jig

Just In Time

Kerf

Keyboard

Kit

Knowledge Management

Label

Laser Repair

Lead scanner

Land grid array (ball grid array with pads instead

of balls)

Leader

lead-time offset

Lean Production

Least Total Cost

Least Unit Cost

Letter Of Credit

Loader

Loader/unloader

Logistics Department

Loss

Lot reject rate

Lifetime

Lifted bond

Loop height

Main Board

Machine

Manufacturing change order

Multi chip package

Material Declaration Data Sheet

拖墨

製程中品質管制

積體電路

集成制造

內部矯正措施要求/報告

國際汽車推動小組

國際電工技術委員會

國際標準化組織

全員參與

抽检夹具

准时化生产

刀痕

鍵盤

測試軌道

知識管理

標籤

雷射修補

掃腳

栅格镇裂封装

領班

前置時間逆推

精益生产

最小總成本法

最小單位成本

信用證

上料區/上板機

上板/下板

運籌部

遺失

批退率

寿命

焊球脱落

弧高

主板

机器

生产变更单

多芯片封装

物料申报清单

Meg/M

MiniSD

MKB

Megabit (1Megabit=1024K)

Media Key Blocks

Multi level cell (more than two states of logic per

MLC

memory cell)

MAU Make up Air Unit

4M1E Man Machine Material Method Environment

M/M Ratio Man VS Machine Ratio

MCC Management Control Center

MIS Management Information System Section

MOP Management of Process

Manual test Manual test

MFG1 Manufacturing Division 1

MFG2 Manufacturing Division 2

MFG3 Manufacturing Division 3

MES Manufacturing Exection System Section

MRP Manufacturing Resource Plan

MRP Materials requirement planning

MS Memory stick 2.0

MS 1.4 Memory stick. Different compatibility from MS 2.0

MS Pro Memory stick Pro. Brand name used by Sony

MS Pro Duo Reduced form factor version of the MS Pro

Mark Mark

Marking Die Marking Die

Mass

Mass Production

Production

MPS Master Production Schedule

MCCS Material Cycle Count Sheet

MIT Material Issue Ticket

MM Material Management

MMC Multi Media card

MRB Material review board

MRD Marketing requirements document

MSDS Material Safety Data Sheet

MSL Moisture Sensitivity Level

MTI Memory test inventory

MAG

Marker pen

Misalign

Mismatch

Missing wire

兆

MiniSD

MKB

MLC

新风空调箱

人机比

管理中心

資訊服務課

管理過程

點測

製造一處

製造二處

製造三處

資訊自動化課

制造资源规划

无聊需求策划

存储棒

MS 1.4

MS Pro

MS Pro Duo

IC正印

不完整區域

量產

主生產排程

物料循環盤點表

領料單

物管

MMC

物料评审委员会

市场需求文件

物料安全数据表

湿气灵敏度等级

Memory 测试库存

弹夹

记号笔

移位

错位

缺线

MRT

MSA

MTO

MFG1 PD1

MFG1 PD2

MFG2 ES1

MFG2 ES2

MFG2 ES3

MFG2 ES4

MFG3 ES

MFG3 PE

MFG3 PD

Microscope

Scope

MBSR

NS

NPI

NA

NAND

NCF

NOR

NCR

NDA

Normal test

Offset

OLAP

OJT

O/S

OI

OR

OP

OPT

OF

Offset

OPTH

ORT

ODM

Mold gate

浇铸口

Molding

塑膜成型

Material Return Ticket

退料單

Measurement System Analysis

量測系統分析

Memory Test Option

記憶體測試選紐

MFG 1 Production Department 1

生產一部

MFG 1 Production Department 2

生產二部

MFG 2 Engineering Support Department 1

工程支援一部

MFG 2 Engineering Support Department 2

工程支援二部

MFG 2 Engineering Support Department 3

工程支援三部

MFG 2 Engineering Support Department 4

工程支援四部

MFG 3 Engineering Support Department

三處工程部

MFG 3 Process Engineering Department

三處製程部

MFG 3 Production Department

三處生產部

Microscope

顯微鏡

Microscope/ Oscilloscope

顯微鏡/示波器

Mutual Beneficial Supplier Relationship

與供應商共榮共利

Network Service Section

網絡服務課

New Product Introduction

新產品導入

No Available

無效的

Not-AND Reference to design architecture and

NAND

cell (Toshiba-type cell)

New configuration form

Not-OR. Reference to design architecture and cell

NOR

(SanDisk&Intel-type cell)

Non-Conformity Report

不符合事項報告

Non-Disclosure Agreement

保密合約書

Normal test

第一次測試

Offset

偏差

On-Line Analytical Processing

線上分析處理

On-the-Job Training

在职培训

Open/Short

短路/開路

Operation instruction

作業指導書

Operation Research

运筹学

Operator

作業員

Optimized Production Technology

最佳生產技術

Oriental Flat

6” 平邊

Offset

偏差

Operating Temperature and Humidity

运行状态下的温室度测试

On going Reliability Testing

可靠性测试

Original Design & Manufacture

委託設計與製造

OEM

OOC

OCAP

OOS

OQC

Output

OD

O/U

O/U kill

P/k Type

P/K

PL

Pad

Pass

Pass/fail

PGU

PCMCIA

PCN

PCT

PDF

Plato

PMC

PPM

Precon

PCI

P&P

PMU

PDCA

PBGA

PLCC

PNP

FMEA

PWR

PM

P/C

Probe mark

Original Equipment Manufacture

Out Of Contol

Out of Control Action Plan

Out Of Specification

Outgoing Quality Control

Output

Optional

Orientation

Outline criteria

Over Driver

Over Kill

Over/under kill

Package Type

packing

Packing List

Pad

Pass

Pass/fail

Pattern Generator Unit

Personal Computer Memory Card International

Association

Process Change Notification

Pressure Cooker Test

Product definition form

Controller for memory stick 1.4

Post Molding Cure

Parts per million

precondition

Personal Computer Interface Board

Pick & Place

Pin Measure Unit

Plan-Do-Check-Action

Plastic Ball Grid Array

Plastic Leadless Chip Carrier

Plug & Play

Potential Failure Mode and Effect Analysis

Power

Preventive Maintenance

Probe Card

Probe mark

委託代工

超出管制

失控反應計劃

超出規格

出貨品質管制

產出

可选的

方向，定位

外观标准

針壓

誤宰

誤宰/誤放

包裝型态

包裝

裝箱單

焊墊

通過

良品/不良品

模式发生器单元

个人电脑存储卡估计委员

会

工程变更通知单

压力饱和湿度测试

产品定义模板

Plato

塑封后烘烤

百万分之一

预处理

电脑介面板

挑揀

針測單元

PDCA

PBGA ，塑料球柵阵列

塑料式引线芯片封裝

热插拔式

潜在失效模式及效应分析

电源

维修保养

针测板

针痕

Prober

PA

Pad

PC Card

PCB

PCBA

PCE

PTS

PCN

PFMEA

PI

PQC

PV

PC

PE

POH

PP

PDN

PD

PPAP

PDP

PGM

PPS

PFW

POD

POD

PO

PR

PR

PUR

Prober

QFP

QA

QAD

Prober

Process Approach

Pad

Type 2 PCMCIA memory card

Printed circuit board

Printed circuit board assembly

Process Engineering

Performance to schedule

Process Change Notification

Process FMEA

Process Improvement

Process Quality Control

Process Vacuum

Product Control Section

Product Engineering Department

Product on Hand

Product Plan Section

Product testing Deviation Notice

Production Dept.

Production Parts Approval Procedure

Production Planning Section

Program

Programmable Power Supply

Promotion From Within

Proof Of Delivery

Package Outline Drawing

Purchase Order

Purchase Requisition

Public Relationship

Purchasing Section

Prober

Package

Plasma Cleanning

Physical Locations

Pick up tool

Preheater

Protective Gloves

Quad Flat Pack

Quality Assurance Section

ERP system used at SanDisk

针测机

流程方法

焊垫

PC Card

印刷电路板

印刷电路板装配

工艺工程

计划完成状况

工程变更通知单

制程失效模式与效应分析

制程改善

制程质量控制

制程真空

生产管理部

产品工程部

預估在手量

生產計劃課

产品测试异常通知單

生产部

生產件批准程序

生產專案計劃課

程序

可编程电源供应

内部提升

出货单

封装外形图

采购单

请购单

公共关系

采购部

针测机

封装类型

等离子清洗

实际位置

吸嘴

预热

保护手套

四方形平面封裝

质量保证

QAD

QAD

QCO

QCP

QC

QDN

QFD

QM

QMS

QS

RC

RDN

RMI

RT

REC

Rej

Release

REL

Req.

R/T

Rev.

Rework

RPN

RCCP

Run

R/C

RH

Quality Assurance Department

Qulity Change Order

Quality Control Plan

Quality Control Section

Quality Deviation Notice

Quality Function Display

Quality Management Division

Quality Management System

Quality System Section

rated capacity

Raw material Deviation Notice

Raw Material Inventory

Receipt Traveler

Record

Reject

Release

Reliability

Requisition

Retest

Revision

Rework

Risk Priority Number

Rough Cut Capacity Planning

Run

Run Card

Relative Humidity

Controller used on CF, 3B and Flash Drives with

RHODES

NAND binary memory

RHODES_1 Same as Rhodes

Controller used on CF, 3B and Flash Drives with

RHODES_2

NAND MLC memory

RMA Returned material authorization

RoHS Substances

Reduced size MMC. Designed for European cell

RS-MMC

phone market

Re-flow

Resin Bleed

SAM Scanning Acoustic Microscope

SCC Supply Chain Management

Scope Microscope/Oscilloscope

SD Secure Digital card

质量保证部

质量变更单

质量管制计划

质量管制

品质异常通知单

質量功能展開

品管处

质量管理系統

质量系统部

定率产能

原材料异常通知單

原材料仓库

采购收货验收单

记录，记录器

不合格品， 剔出

允许，放行

可靠性

用人需求

重测

版本

返工

風險領先指標

粗略产能规划

生产

流程卡

相对湿度

RHODES

RHODES_1

RHODES_2

退回物料认可

有害物质的限制

RS-MMC

回流焊

注塑溢出

超声波扫描显微镜

供应链管理

显微镜/示波器

SD

SDIL

SDKK

SDP3B

SDSH

SD-SIP

SDTW

SDUBGA

SDUS

SDXX

Setup

SIP

SLC

SMD

SMMC

SMT

Socrates

SOD

SPARTA

SPIL

SALES/CS

SALES

Sample

SEM

Scrap

Scratch

Scribe L.

Sec.

Security

SCU

Setup

S/U

Slot

SOJ

SOP

S/W

Sort

Sort Flow

SanDisk Israel

SanDisk Japan

SanDisk type 2PCMCIA memory card.

Sometimes referred to as 3B

SanDisk Shanghai, China

Secure Digital card assembled using an SIP

module (not surface mount)

SanDisk Taichung,Taiwan

Stacked die ultra thin ball grid array (sharp

package)

SanDisk USA

SanDisk Xixiang, Shenzhen, China

Setup

System in package

Single level Cell

Surface Mount Device

Stacked MMC (contains 2 memory devices)

Surface mount technology (used to assemble

cards)

Controller for memory stick, memory stick pro,

and memory stick duo

Substrate Outline Drawing

Based generation of CF and 3B cards

Sales / Customer Service Division

Sales Department

Sample

Scanning Electron Microscope

Scrap

Scratch

Scribe line

Section

Security

Sense Control Unit

Setup

Site Unbalance

Slot

Small Outline J-lead Package

Small Outline Package

Software

Sort

Sort Flow

SDIL

SDKK

SDP3B

SDSH

SD-SIP

SDTW

SDUBGA

SDUS

SDXX

设置，装备

系统级封装

SLC

表面贴装器件

SMMC

表面贴装技术

Socrates

基板外形图

SPARTA

SPIL公司

销售/客服處

销售部

样品

电子扫描显微镜

报废

刮伤，刮痕

切割道

安全性

感应控制单元

设置， 装备

Site 不平衡

槽位

小外型J接腳封裝

小外型封裝

软件

测试，分类

测试流程

SBC Special Bin Account

Special Document & Engineering Change

SECR/N

Request/Notice

SER Special Engineer Report

SOR Special Order Request

SPEC Specification

Spindle Spindle

SOP Standard Operation Procedure

ST Standard Time

SPC Statistical Process Control

SIS Strategic Information System

Subcontractor Subcontractor

Summary Summary

Summary/rep

Summary/report

ort

Supervisor Supervisor

SCM Supply Chain Management

SOP Support of Process

Chipping surface, bottom, side Chipping.

SDRAM Synchronous DRAM

SE System Engineering

Sagging wire

Singulation

Stitch

Stitch shape

Strip

Substrate

Transflash Removable triflash product

TST Test Operation

TST Thermal Shock Test

Thermosonic wire bonder

Transfer pressure

TS Technical Specification

Temp Temperature

TECR/N

TDTP

TD

TPU

Tester

TH

Temporary Document & Engineering Change

Request/Notice

Test Data Transfer Program

Test Development Department

Test Processor Unit

Tester

Tester Head Unit

特殊bin计数

特殊文件及工程变更申请/

通知

特殊工程变更

特殊订单需求

规范，说明书

转轴

标准作业程序

标准时间

统计制程管制

策略信息系統

進貨廠商

总结

报表

主管

供应链管理

支持過程

碎裂

SDRAM

系统工程

金线下塌

切割成型

第二焊点

第二焊点形状

条

基板

Transflash

测试部

液体冷热冲击测试

超声波焊线机

注塑压力

技术规范

溫度

临时性文件及工程变更申

請/通知

测试资料转换程序

TD工程部

测试過程單元

测试机

測試頭單元

TOC

THK

TQFP

TSOP

TGU

TPM

TQM

TTV

TPS

Tray

Trial Run

Tube

UPW

UV

UPS

UPH

Unloader

UIF

UMC

Unloader

USB

UTC

UTOP

UUT

UTIL

VI

V/M

V-notch

VCO

VIP

VQFP

VSOP

VIO

Wafer

Cassette

WM

WM

W/S

Theory of Constraints

Thickness

Thin Quad Flat Pack

Thin Small Outline Package

Timing Generator Unit

Total Production Management

Total Quality Management

Total Thickness Variation

Toyota Production System

Tray

Trial Run

Tube

Ultra Pure Water

Ultraviolet

UV-tape

Uninterrupted Power Supply

Unit Per Hour

Unloader

User Interface Unit

Unloader

Universal serial bus

Ultra-thin outline package

Unit Under Test

Utilization

Visual Inspection

Visual Manual

V-notch

Vendor change order

Vertically integrated partner (a CM that performs

every manufacturing step)

Very thin quad flat pack (controller package)

Very thin small outline package (thin TSOP)

Voltage Input & Output Unit

Wafer

wafer Cassette, metal Cassette

Wafer map

Wafer Mount

Wafer Sort

限制理論

厚度

薄型四方扁平封裝

薄型小尺寸封装

时钟发生器单元

全面生产管理

全面质量管理

厚度总差异值

丰田生产方式

盘状IC存放容器

试产

存放IC的管条

超纯水

紫外線

紫外线膜

不间断电源

单位小时产出数

下料区/下板机

用户介面单元

UMC公司

下料机

USB

UTC公司

UTOP

测试的样品

稼動率

外观目检

人工目检

8”V型缺口

供应商更改单

VIP

VQFP

VSOP

电压输入输出单元

晶圆,晶片

晶圆盒， 材料箱

晶圓測試圖

贴片，贴片工艺

晶圆测试

W/S

WEEE

WI

WiFi

WLP

WM

WLAN

WM

5W1H

WIP

W/S

xD

YOK

Yield

Z

Workstation

Waste electrical, electronic equipment

Work instrucion

Same as WLAN (802.11b)

Wafer Level Package

Wafer Mount

Wireless local area network standard (802.11b)

Warehouse Management Department

When where who what why how

Work in process

Workstation

Warpage

Wafer mark

Wire crossing

Wire damage

Wire sweeping

Wrist strap

xD Picturecard. Only used on Olympus platforms

Yokkaichi,a wafer fab.

Yield

ZONE

工作站

废气电子设备

作业指导书

无线互联网接入

晶圆级封装

贴膜

无线局域网

倉庫管理部

5W1H

在线品

工作站

变形弯曲

水印

引线交叉

金线受损

引线弯曲

静电腕带

XD卡

Yokkaichi公司

良品率

區