2024年4月23日发(作者：)
专利内容由知识产权出版社提供
专利名称：Wafer cleaning method
发明人：Mario E. Bran
申请号：US09643328
申请日：20000822
公开号：US06295999B1
公开日：20011002
专利附图：
摘要：Semiconductor wafers are cleaned using megasonic energy to agitate cleaning
fluid applied to the wafer. A source of energy vibrates an elongated probe which
transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a
flared or stepped rear base. In one form, the probe is made of one piece, and in another,
the rod fits into a socket in the base. This enables a rod to be made of material which is
compatible with the cleaning solution, while the base may be of a different material. A
heat transfer member acoustically coupled to the probe base and to a transducer
conducts heat away from the transducer. A housing for the heat transfer member and
the transducer supports those components and provides means for conducting coolant
through the housing to control the temperature of the transducer. In another
arrangement, an end of the housing is coupled between the transducer and the probe. In
one arrangement, fluid is sprayed onto both sides of a wafer while a probe is positioned
close to an upper side. In another arrangement, a short probe is positioned with its end
face close to the surface of a wafer, and the probe is moved over the wafer as it rotates.
The probe may also be positioned through a central hole in a plurality of discs to clean a
group of such elements at one time.
申请人：VERTEQ, INC.
代理机构：Knobbe, Martens, Olson & Bear, LLP
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