2024年4月23日发(作者：)

一种倒装芯片固晶装置及方法

英文回答：

Flip Chip Bonding Apparatus and Method.

Abstract.

This invention relates to a flip chip bonding apparatus

and method for bonding a flip chip to a substrate. The flip

chip bonding apparatus includes a bonding head having a

bonding surface, a heating element, and a cooling element.

The bonding surface is configured to contact the flip chip

and the substrate. The heating element is configured to

heat the flip chip and the substrate. The cooling element

is configured to cool the flip chip and the substrate. The

flip chip bonding method includes providing a flip chip and

a substrate, positioning the flip chip on the substrate,

heating the flip chip and the substrate, and cooling the

flip chip and the substrate.

Detailed Description.

The present invention relates to a flip chip bonding

apparatus and method for bonding a flip chip to a substrate.

Flip chips are semiconductor devices that have their active

surface facing downward. Flip chips are typically bonded to

a substrate using a solder reflow process. In the solder

reflow process, the flip chip and the substrate are heated

to a temperature above the melting point of the solder. The

solder melts and forms a bond between the flip chip and the

substrate.

The present invention provides a flip chip bonding

apparatus and method that can be used to bond flip chips to

substrates in a more efficient and reliable manner. The

flip chip bonding apparatus of the present invention

includes a bonding head having a bonding surface, a heating

element, and a cooling element. The bonding surface is

configured to contact the flip chip and the substrate. The

heating element is configured to heat the flip chip and the

substrate. The cooling element is configured to cool the

flip chip and the substrate.