2024年4月16日发(作者：)

印 制 电 路 板

（Printed Circuit Boards）

IPC-M-105

IPC-D-325A

IPC-PE-740A

IPC-MB-380

IPC-D-326A

IPC-6010 Series

IPC-6011

IPC-6012B

IPC-6015

IPC-6016

IPC-6018A

IPC-A-600G

IPC-QE-605A

IPC-PWB-EVAL-CH

IPC-HM-860

IPC-TF-870

Rigid Printed Board Manual

刚性印制板设计手册

Documentation Requirements for Printed Boards 印制板设

计文件图册要求

Troubleshooting for Printed Board Manufacture and

Assembly

印制板制造和组装的故障排除

Guidelines for Molded Interconnection Devices

模压互连器件导则

Information Requirements for Manufacturing Printed Circuit

Boards and Other Electronic Assemblies

印制板制造和其它电子组装的信息要求规范

IPC-6010 Qualification and Performance Series

IPC-6010印制电路板质量标准和性能规范系列手册

Generic Performance Specification for Printed Boards

印制板通用性能规范

Qualification and Performance Specification for Rigid Printed

Boards

刚性板的合格和性能规范要求

Qualification & Performance Specification for Organic

Multichip Module (MCM-L) Mounting and Interconnections

有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能

规范

Qualification & Performance Specification for High Density

Interconnect (HDI) Layers or Boards

高密度互连(HDI)层或印制板的鉴定与性能规范

Microwave End Product Board Inspection and Tech

微波成品印制板的检验和测试

Acceptability of Printed Boards

印制板验收条件

Printed Board Quality Evaluation Handbook

印制板质量评价

Printed Circuit Board Defect Evaluation Chart

印制板缺陷评估图表

Specification for Multilayer Hybrid Circuits

多层混合电路规范

Qualification and Performance of Polymer Thick Film Printed

Boards

聚合物厚膜印制板的鉴定与性能

IPC-ML-960

IPC-TR-481

IPC-TR-551

IPC-TR-579

IPC-4552

IPC-DR-572

IT-95080

IPC-NC-349

IPC-SM-839

IPC-HDI-1

IPC/JPCA-4104

IPC-6016

IPC/JPCA-6801

IPC-DD-135

Qualification and Performance Specification for Mass

Lamination Panels for Multilayer printed Boards

多层印制板的鉴定与性能规范用预制内层在制板的鉴定与

性能规范

Results of Multilayer Tests Program Round Robin

多层印制板联合试验计划结果

Quality Assessment of Printed Boards Used for Mounting and

Interconnecting Electronic Components

用于电子元件安装与互连的印制板质量评价

Round Robin Reliability Evaluation of Small Diameter Plated

Through Holes in PCBs

印制板中小直径镀覆孔可靠性评价联合试验

Specification for Electroless Nickel/Immersion Gold(ENIG)

Plating for Printed Circuit Boards

印制电路板表面非电镀镍/沉金规范

Drilling Guidelines for Printed Boards

印制板钻孔导则

Improvements/Alternatives to Mechanical Drilling of PCB

Vias

印制板通孔机加工方案的改进和优选手册

Computer Numerical Control Formatting for Drillers and

Routers

钻床和铣床用计算机数字控制格式

Pre & Post Solder Mask Application Cleaning Guidelines

施加阻焊前及施加后清洗导则

High Density Interconnect Microvia Technology

Compendium

高密度(HDI)互连微通孔技术纲要

Specification for High Density Interconnect (HDI) and

Microvia Materials

高密度互连(HDI)及微导通孔材料规范

Qualification & Performance Specification for High Density

Interconnect (HDI) Layers or Boards

高密度互连(HDI)层或印制板的鉴定与性能规范

IPC/JPCA Terms & Definitions, Test Methods, and Design

Examples for Build-Up/High Density Interconnection

积层/高密度互连的术语和定义、试验方法与设计例

Qualification Testing for Deposited Organic Interlayer

Dielectric Materials for Multichip Modules

多芯片组件内层有机绝缘材料的鉴定试验

IT-96060

IT-97071

IT-30101

IT-98123

IPC-2141A

IPC-2251

IPC-2252

IPC-4103

IPC-6018A

IPC-D-317A

IPC-M-102

IPC-4202

IPC-4203

IPC-4204

IPC-6013A

IPC/JPCA-6202

High Density PCB Microvia Evaluation (October Project),

Phase I, Round 1

高密度印制板微通孔评价指标手册, 第一期第一版

High Density PCB Microvia Evaluation, Phase I, Round 2

高密度印制板微通孔评价指标手册, 第一期第二版

High Density PCB Microvia Evaluation, Phase I, Round 3

高密度印制板微通孔评价指标手册, 第一期第三版

Microvia Manufacturing Technology Cost Analysis Report

微通孔制作技术成本核算报告

Controlled Impedance Circuit Boards & High Speed Logic

Design

控制阻抗电路板与高速逻辑设计

Design Guide for the Packaging of High Speed Electronic

Circuits

高速电子电路封装的设计指南

Design Guide for RF/Microwave Circuit Boards

射频/微波电路板设计指南

Specification for Base Materials for High Speed/High

Frequency Applications

高速高频用基材规范

Microwave End Product Board Inspection and Test

微波成品印制板的检验和测试

Design Guidelines for Electronic Packaging Utilizing High

Speed Techniques

采用高速技术电子封装设计导则

Flexible Circuits Compendium

挠性电路纲要

Flexible Base Dielectrics for Use in Flexible Printed Circuitry

挠性印制线路用挠性绝缘基底材料

Adhesive Coated Dielectric Films for Use as Cover Sheets for

Flexible Printed Circuitry and Flexible Adhesive Bonding

Films

挠性印制线路覆盖层用涂粘接剂绝缘薄膜

Flexible Metal-Clad Dielectrics for Use in Fabrication of

Flexible Printed Circuitry

挠性金属箔去电应用于柔性电路组装

Qualification & Performance Specification for Flexible

Printed Boards

挠性印制板的鉴定与性能规范

IPC/JPCA Performance Guide Manual for Single- and

Double-Sided Flexible Printed Wiring Boards

IPC/JPCA单双面挠性印制板性能手册

IPC-FA-251

IPC-FC-234

IPC-M-107

IPC-MI-660

IPC-4101A

IPC-4121

IPC-4562

IPC-CF-148A

IPC-CF-152B

IPC-TR-482

IPC-TR-484

IPC-TR-485

IPC-4412

IPC-4130

IPC-4110

IPC-4411-A

Guidelines for Assembly of Single- and Double-Sided Flex

Circuits

单面和双面挠性电路组装导则

Composite Metallic Materials Specification for Printed

Wiring Boards

印制线路板复合金属材料规范

Standards for Printed Board Materials Manual 印制板材料标

准手册

Incoming Inspection of Raw Materials Manual 原材料接收

检验手册

Specifications for Base Materials for Rigid and Multilayer

Printed Boards

刚性及多层印制板用基材规范

Guidelines for Selecting Core Construction for Multilayer

Printed Wiring Board Applications 多层印制板用芯板结构

选择导则

Metal Foil for Printed Wiring Applications

印制线路用金属箔

Resin Coated Metal for Printed Boards

印制板用涂树脂金属箔

Composite Metallic Materials Specification for Printed

Wiring Boards

印制线路板复合金属材料规范

New Developments in Thin Copper Foils

薄铜箔的新发展

Results of IPC Copper Foil Ductility Round Robin Study

IPC铜箔延展性联合研究结果

Results of Copper Foil Rupture Strength Test Round Robin

Study

铜箔断裂强度试验联合研究结果

Specification for Finished Fabric Woven from ”E” Glass for

Printed Boards

“E”类精纺玻璃纤维层印制板技术规范

Specification & Characterization Methods for Nonwoven "E"

Glass Materials

E 玻璃纤维非织布材料规范及性能确定方法

Specification and Characterization Methods for Nonwoven

Cellulose Based Paper for Printed Boards

印制板用纤维纸规范及性能确定方法

Specification and Characterization Methods for Non-Woven

Para-Aramid Reinforcement

聚芳基酰胺非织布规范及性能确定方法

IPC-SG-141

IPC-A-142

IPC-QF-143

IPC-2524

IPC-9151A

IPC-9191

IPC-9199

IPC-9252

IT-97061

IT-98103

IPC-MS-810

IPC-QL-653A

IPC-TR-483

IPC-TR-486

Specification for Finished Fabric Woven from "S" Glass for

Printed Boards

印制板用经处理S玻璃纤维织物规范

Specification for Finished Fabric Woven from Aramid for

Printed Boards

印制板用经处理聚芳酰胺纤维编织物规范

Specification for Finished Fabric Woven from Quartz (Pure

Fused Silica) for Printed Boards

印制板用经处理石英（熔融纯氧化硅）纤维编织物规范

PWB Fabrication Data Quality Rating System

印制板制造数据质量定级体系

Printed Board Process, Capability, Quality and Relative

Reliability Benchmark Test Standard and Database

印制板工艺, 容量, 质量,可靠性试验标准和数据库

General Guidelines for Implementation of Statistical Process

Control (SPC)

实施统计过程控制(SPC)的通用导则

Statistical Process Control (SPC) Quality Rating

统计分析控制

Guidelines and Requirements for Electrical Testing of

Unpopulated Printed Boards

未组装印制板电测试要求和指南

PWB Hole to Land Misregistration: Causes and Reliability

印制线路板通孔与焊盘的错位: 原因和可靠性

Reliability of Misregistered and Landless Innerlayer

Interconnects in Thick Panels

多层板内部无焊盘层互连错位的可靠性

Guidelines for High Volume Microsection

大批量显微剖切导则

Certification of Facilities that Inspect/Test Printed Boards,

Components & Materials

印制板、元器件及材料检验试验设备的认证

Dimensional Stability Testing of Thin Laminates-Report on

Phase 1 & 2 International Round Robin Test

薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶

段报告

Round Robin Study to Correlate IST & Microsectioning

Evaluations for Inner-Layer Separation

内层分离的互连应力测试(IST)与显微剖切相关性联合研

究