2024年4月11日发(作者：)
专利内容由知识产权出版社提供
专利名称：Substrate reclamation method and
apparatus
发明人：Beinglass , Israel,Miller, Paul V.
申请号：EP04252719.2
申请日：20040511
公开号：EP1482538A3
公开日：20060104
专利附图：
摘要：Test substrates used to test semiconductor fabrication tools are reclaimed by
reading from a database (112) the process steps performed on each test substrate and
selecting a reclamation process (120) from a plurality of reclamation processes, for
reclaiming each test substrate. Information identifying the processes performed on each
test substrate and the reclamation process selected for each test substrate, may be
stored in a test substrate history database (120). Each test substrate is sorted and placed
into a group of test substrates (112) having a common reclamation process assigned to
the test substrates of the group. The bins (118) in which the sorted test substrates are
stored are each labelled with identifying information including basic or detailed
information on the reclamation process selected for the test substrates stored in the bin.
申请人：APPLIED MATERIALS, INC.
地址：P.O. Box 450-A Santa Clara, CA 95052 US
国籍：US
代理机构：Bayliss, Geoffrey Cyril
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