2024年4月11日发(作者：)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE HEATER

发明人：NAKADA RENPEI

申请号：JP822690

申请日：19900119

公开号：JPH03215670A

公开日：19910920

摘要：PURPOSE:To efficiently heat a substrate and to suppress the temp. rise of a

fixing jig as well as to prevent the sticking of thin films by fixing the substrate by the fixing

jig onto a sample base, heating the substrate, providing a heat reflecting means in the

fixing jig and reflecting the heat of a heating means. CONSTITUTION:The substrate 7 is

mounted via a heater 8 on a quartz susceptor 6 and is fixed by the fixing jig 12 in a

reaction chamber 3 in a vessel 1 which is equipped with a cooling pipe 2 to allow cooling.

The above-mentioned heater 8 is constituted by enclosing a tungsten wire 9 connected

with copper wires 11 with alumina 10. The substrate 7 is heated to a prescribed temp. by

this heater 8 and while vacuum evacuation is made from a discharge port 5, gaseous raw

materials introduced from a pipe 4 are cracked and the thin film is formed on the

substrate. An aluminum film 13 is provided between the heater 8 and fixing jig 12 of the

above-mentioned substrate heater for a CVD method to reflect the heat of the heater 8.

The heating efficiency is improved by utilizing reflected heat for substrate heating and

the temp. rise of the fixing jig 12, etc., is suppressed to prevent the formation of the thin

films to these parts. The lowering of the speed of forming the thin film on the substrate

7 and the generation of dust are averted.

申请人：TOSHIBA CORP

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