2024年4月11日发(作者：)

专利内容由知识产权出版社提供

专利名称：RESISTOR COMPOSITE SUBSTRATE

发明人：IKEDA TERUYUKI,SHIMADA YUUZOU

申请号：JP788083

申请日：19830120

公开号：JPS59132643A

公开日：19840730

摘要：PURPOSE:To compound resistors of a large number in one substrate, and to

enable to trim the whole resistors thereof by a method wherein conductors and the

resistors of the plural number are formed inside of the laminated substrate, a part of the

outside circumferential parts of the respective resistors and a part of the conductors are

exposed on the same face of the surface of the substrate, and the other conductors are

exposed on the other surface part. CONSTITUTION:An insulator sheet 22 having lead-out

electrodes 21, an insulator sheet 28 having a resistor sheet 23 and a lead-out pattern 25

thereof, an insulator sheet 30 having a conductor pattern 29, and an insulator sheet 31

are arranged at the first-the fourth layers, and from the second layer to the fourth layer

are arranged repeatedly. The respective sheets are stacked, lamination and baking are

performed to obtain a sintered body having resistance circuits of four pieces, for

example. Moreover, conductive materials 36 are put together by baking to decide the

resistance values formed in the inside layers to a cut surface 33 having the resistor edge

faces 34 and the conductor edge faces 35. Because the substrate obtained by this way

has laminated structure, the number of circuits can be increased or decreased freely, and

whole trimming can be performed easily.

申请人：NIPPON DENKI KK

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